RMA 07D00 30CC 25G WH

Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus™ is perfect for BGA rework, mobile device repair, reflowing solder paste, and more. Unlike liquid fluxes, tacky FluxPlus can be applied exactly where needed without contaminating nearby areas. We provides a wide array of formulations for use in a variety of applications.

Features & Benefits
· Controlled flux spread as a result of precise dispensing
· Holds small parts in place before soldering
· Delivers more flux compared to flux-core wire solder
· Formulas for wetting to difficult-to-solder surfaces (stainless steel, etc.)
· Convenient sizes: 10cc, 30cc, 55cc, and 70cc syringes; 6 oz cartridges; and 2 oz and 6 oz jars
· Compatible with range of dispensing solutions, including jetting systems